材料特點(diǎn):
1.無鉛高Tg材料
2.材料Tg≥170°C(DSC),Td≥352。C
3.與FR-4制造工藝兼容
4.更低Z-CTE及高耐熱信賴性,良好的抗CAF能力
Material Characteristics
1.Lead free high Tg material
2.TG≥170 °C (DSC),TD≥352。C
3.Compatible with FR- 4 manufacturing process
4.Lower Z-CTE and high heat-resistant reliability,
excellent CAF resistance
產(chǎn)品應(yīng)用:
高多層板、背板、服務(wù)器、網(wǎng)絡(luò)通訊
對等材料:IX-X8XX.
Product Application
High multi-layer board, backplane, server, network
communication
Equivalent material: |X-X8XX